Solamet® is the industry innovation leader in delivering metallization solutions enabling high efficiency cell technologies, including p-BSF, p-PERC, n-PERT/TOPCon, n-HJT, IBC and thin-film solar cells, etc.
Proprietary breakthrough Pb-Te-O glass frit chemistry enabled LDE technology
Proprietary one paste solution for IBC to contact both n+ and p+
First commercially available metallization package for high efficiency n-PERT
Pace setter in advancing fine line printing (<15um screen openings)
Innovative total metallization package to enable higher efficiency n-TOPCon
Unique formulation design for superior cured resistivity, printability, and storability
Solamet's Pb-Te-O frit chemistry enabled LDE and is the backbone for high efficiency metallization pastes for advanced solar cells.
Continuous optimization of the Pb-Te-O chemistry to achieve increasingly higher cell efficiencies
Created effective electrical contact between the silver lines from the paste and the solar wafer, while not damaging the emitter. Enabled the use of wafers with lightly doped emitter (LDE) diffusion profiles resulting in a step-change in cell efficiency
More efficient power generation
Reduce cost by lower laydown (i.e., less paste laydown)
Widen solar wafer firing temperature window
Improve adhesion during the panel making process
Active Solamet® patent families
