Built from 200+ years of innovation DNA and 40 years of metallization practice, Solamet Electronic Materials Co., Ltd. was launched in 2021 as an independent company following the acquisition of DuPont Solamet® photovoltaic metallization paste business.
A Legacy of 40 Years of Proven Innovation
Solamet® proprietary Pb-Te-O technology is a game changer that makes the essential difference in PV industry.
We are the enabler of higher efficiency and higher power.
Mainstream c-Si solar cell with back side passivated
Solamet® p-type metallization pastes can deliver higher cell efficiency, improve production yield and lower non-Si cost by
• Excellent fine line printing capability and long-term printability demonstrated on both standard and MCF screens
• Wider firing window with excellent Jo,m and contact performance for both standard and high Rsheet emitters using proprietary Pb-Te-O chemistry
• Superior adhesion and soldering window for both single-printing and dual-printing
• Customized products with excellent anti-acid capability
Advanced c-Si solar cell with higher efficiency potential.
Solamet® PV3Nx/PV6Nx n-TOPCon metallization package enables higher efficiency and lower laydown
• Enables significant efficiency gain while achieving lower laydown via excellent fine line printing capability on MCF screens
• PV3Nx front side Ag/Al paste with novel inorganics delivering reduced Jo,m while maintaining excellent contact and finger resistances
• PV6Nx back side Ag paste with customized frit chemistry that minimizes the sintering through poly-silicon to achieve good contact and higher Voc
• Customized total package solution offering excellent co-firing window and higher EL yield
Advanced hetero-junction solar cell with higher efficiency potential and less power degradation at higher temperature in the field.
Solamet® PV4xx provides dual printing low temperature paste solution to maximize bus and finger performance respectively.
• PV4xx finger paste with a unique silver and organic system delivering superior bulk resistivity and excellent printability to <24um opening screens
• Busbar paste with good adhesion and solderability
• Combined dual printing package offers substantial laydown saving opportunities
Solamet offers unique product solutions for high efficiency back contact cell architectures
• Solamet® PV93x one-paste solution for IBC solar cells that can simultaneously contact both the exposed n+ and p+ regions at moderate firing conditions (500-650 oC)
Customized Pb-Te-O chemistry with excellent contact window for advanced p-IBC technologies
• Solamet® PV73x via paste for MWT delivering excellent via filling while minimizing leakage current
Next generation tandem solar cell with highest efficiency potential.
Solamet® PV42x provides low temperature paste with excellent resistivity even under low curing temperature 130degC, which is suitable for thin film perovskite based cell technologies requiring lower processing temperatures.
